Following
the introduction of the RoHS Directive and
the forthcoming restriction of lead in soldering materials different
process parameters will be required to handle the new generation
of solder alloys and board finishes. To assist those performing
assembly, rework and repair operations the characteristics of RoHS
compliant products have been categorised by JEDEC standards under
three headings:
MSL
(Moisture Sensitivity Level), PBT
(Peak Body Temperature) and 2nd
Level Interconnect (Terminal Finish/Material).
This
vital product performance information can be obtained when using
Anglia's Part
Tracker service by clicking on the 'information icon' and is
also included on Anglia's product labelling.
The
table below explains the Peak Body Temperature classifications.
| |
Figures
indicate PBT in Celsius together with dwell time in seconds
Reflow
Soldering - Surface Mount Devices
As
defined by the joint industry standard IPC/JEDEC J-STD-020C |
|
Package
Thickness |
Volume
mm3 <350 |
Volume
mm3
350 - 2000 |
Volume
mm3
>2000
|
<1.6mm |
260°C
max. |
260°C
max. |
260°C
max. |
1.6mm
- 2.5mm |
260°C
max. |
250°C
max. |
245°C
max. |
>2.5mm |
250°C
max. |
245°C
max. |
245°C
max. |
Wave
Soldering
As
specified by the individual manufacturers.
|
Back to RoHS main page |
